型号 | 厂家 | 封装 | 批号 |
AZC099-04S.R7G | AMAAING | SOT23-6 | 2013+ |
ESD05V04D-LA | SOD323 | 2015+ROHS | |
HMD0524P | DFN10 | 2015+ROHS | |
0603ESD-18 | C0603 | 2015+ROHS | |
CESD0402V05B-TR | C0402 | 2015+ROHS | |
TVQ040201AB1 | INPAQ | C0402 | 2015+ROHS |
LTBV03C | LT | SOD323 | 2015+ROHS |
EGS04V12A02T | C0402 | 2015+ROHS | |
RSE12V030R2 | RS | C0402 | 2015+ROHS |
ESD5306D | WILL | DFN4120-10L | 2015+ROHS |
ESD5325E | WILL | SOT-23-6L | 2015+ROHS |
ESD5341X | WILL | FBP-02C | 2015+ROHS |
ESD5345H | WILL | MSOP-10L | 2015+ROHS |
ESD5351N | WILL | DFN1006-2L | 2015+ROHS |
ESD5411N | WILL | DFN1006-2L | 2015+ROHS |
ESD5425E | WILL | SOT-23-6L | 2015+ROHS |
ESD5432E | WILL | SOT-23 | 2015+ROHS |
ESD5451R | WILL | DFP1006-2L | 2015+ROHS |
ESD5452N | WILL | DFN1006-3L | 2015+ROHS |
ESD5471S | WILL | SOD-523 | 2015+ROHS |
ESD5471Z | WILL | DFN0603-2L | 2015+ROHS |
ESD5621W04 | WILL | SOD-323F | 2015+ROHS |
ESD5621W | WILL | SOD-323F | 2015+ROHS |
ESD5641D07 | WILL | DFN2.0*2.0-3L | 2015+ROHS |
ESD5641D15 | WILL | DFN2.0*2.0-3L | 2015+ROHS |
随着4G牌照发放的临近,相关产业链的厂商们早已闻风而动。其中芯片和终端厂商成为重中之重。就像业内所言,4G的关键在终端,终端在于芯片和模。 高通抢跑4G芯片 对手面临压力 据记者了解,目前中国移动2013年度采购的TD-LTE